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Grinding
The outer circumference of the monocrystalline ingot is grinded to make the diameter uniform.
Slicing
The outer circumference of the monocrystalline ingot is grinded to make the diameter uniform.
Beveling
A grindstone grinds the outer circumference of the wafer to fit the product diameter and corrects the end surface into an arc shape to improve the mechanical strength.
Lapping
The carrier, in which the wafer is set, rotates, and both sides of the wafer are roughly polished with abrasive grains to make them parallel.
Back Treatment
Gettering sites are formed on the backside of the wafer to remove impurities that cause metal contamination from the device active layer.
Fine Surface Edge Polishing
Unnecessary substances and damage marks remaining on the wafer bevel are removed by polishing.
Mirror Polishing
The wafer bounded plate is set on a rotating surface plate with a polishing cloth attached. A high flatness wafer is realized by chemical mechanical polishing while supplying the polishing liquid.
Cleaning
Chemicals and ultrapure water remove all types of contaminants such as ultrafine particles, and traces of organic and metal contaminants.
Wafer Flatness Inspection
The inspections such as flatness, resistivity, and number of micro defects on the wafer surface are performed with various devices.
Final Inspection
Skilled inspectors carry out visual inspection of the wafer surface, and the number of micro defects is inspected by the equipment.
Packaging
In an environmentally controlled clean room, wafers are placed in a shipping case that has been appropriately cleaned, and then enclosed in a special bag that allows no moisture to pass through.
